Part # NNA-WCU(1,1000)

Price: $3,000

NanoNeedle Array (NNArrayTM) Specification
Technical Data Typical Range
Needle Material Ag2Ga NA
Average needles length (µm) 25 15 - 50
Needle angle (with respect to the surface) 90° 60°- 120°
Average needles diameter (nm) 750 600 - 1000
Number of needles in the array 1000 800-1200



Substrate Specifications
Technical Data Typical Range
Substrate material Si NA
Chip size 10 mm × 10 mm NA
Silicon cone pitch size (µm) 30 20 - 40
Silicon cone height (µm) 30 20 - 40
Chip tilting angle on holder Flat NA
Coating W-Cu NA
Coating thickness (nm) 400 300 - 500 
Protection coating Pt NA
Number of Chip 1

 

NaugaNeedles NNArrayTM

NaugaNeedles is proud to introduce a unique patent pending [1] products called NNArrayTM. NaugaNeedles offers arrays of nanoneedles that are formed on prefabricated silicon microstructures.  The technology is used to provide a method and apparatus of restoring sharp probes attached to the manipulator inside a dual beam (FIB-SEM) without a need to open up the vacuum chamber.  The NNArrayTM for in-situ restoration of probe tips saves considerable time and resources. The time required for sharpening a tungsten probe using NNArrayTM is less than 10 minutes. While the time for sharpening a tungsten probes using FIB more than 45 minutes. In addition, the tungsten probes need to be changed (by breaking the vacuum and opening the chamber) after 4 to 5 times of sharpening the probes.     
The NNArrayTM is also used for construction and application of various shapes of nanoforks inside a FIB vacuum chamber. The nanofroks are used to handle specimen without the need to weld the specimen to the probe.
Each NNArrayTM includes more than a thousand silver/gallium nanoneedles that can last several month of supply for the in-situ lift-out process. Nanoneedles are between 15 and 50 µm in length and 600 to 1000 nm in diameter.

 

 

 

 

 

 


[1] Mehdi Yazdanpanah, Romaneh Jalilian, David Mudd, Brian Miller "Methods and Apparatuses of Using Metal Needle Arrays for Specimen Lift-Out and Circuit Edit" (U.S. Patent Application No. 13/366,316)